Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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As expected, the side wall deposition was thicker for 53 ° tilt than for 17 ° tilt. | As expected, the side wall deposition was thicker for 53 ° tilt than for 17 ° tilt. | ||
[[File:tilt27_sample1-_01.jpg|400px|thumb|left|17 ° tilt: Side wall deposition of Ti/Au on Si and nLOF resist.]] | [[File:tilt27_sample1-_01.jpg|400px|thumb|left|17 ° tilt: Side wall deposition of Ti/Au on Si and 1 µm tall nLOF resist.]] | ||
[[File:tilt53_sample2_01.jpg|400px|thumb|right|53 ° tilt: Side wall deposition of Ti/Au on Si and nLOF resist.]] | [[File:tilt53_sample2_01.jpg|400px|thumb|right|53 ° tilt: Side wall deposition of Ti/Au on Si and 1 µm tall nLOF resist.]] | ||