Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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==Acceptance test and test results== | ==Acceptance test and test results== | ||
In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. | |||
The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness. | The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness. | ||
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Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | ||
Full acceptance test report here: | '''Full acceptance test report here:''' | ||
[[:File:Temescal Acceptance Test Results Mar-April-May 2018.pdf]] | [[:File:Temescal Acceptance Test Results Mar-April-May 2018.pdf]] | ||
= Vacuum performance = | |||