Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions
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[[File:Picture00.png|650px|center|thumb|Fig. 1: Schematic representation of a substrate, adhesion layer and overlayer system. The substrate is either a dielectric or semiconductor material and the over-layer is a metal.]] | [[File:Picture00.png|650px|center|thumb|Fig. 1: Schematic representation of a substrate, adhesion layer and overlayer system. The substrate is either a dielectric or semiconductor material and the over-layer is a metal.]] | ||
Here the first recommendations on the adhesion layers best suited for specific nanodevice applications are presented. Below the background and characterization work carried out on on two main thin-film systems, Cr/Au and Ti/Au stacks to arrive at these recommendations is presented. | Here the first recommendations on the adhesion layers best suited for specific nanodevice applications are presented. Below the background and characterization work carried out on on two main thin-film systems, Cr/Au and Ti/Au stacks, to arrive at these recommendations is presented. | ||
= Adhesion layer effect on Au thin films = | = Adhesion layer effect on Au thin films = | ||