Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions
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The Ti/Au parallel behavior and Cr/Au inter-diffusion seem to have a larger impact on the electrical properties of the multilayer systems than the nanostructure change observed by TKD. For both samples, the increase of grain boundary scattering due to the higher density of grain boundaries, compared to pure Au, could not be measured with setup used, but cannot be excluded a priori. | The Ti/Au parallel behavior and Cr/Au inter-diffusion seem to have a larger impact on the electrical properties of the multilayer systems than the nanostructure change observed by TKD. For both samples, the increase of grain boundary scattering due to the higher density of grain boundaries, compared to pure Au, could not be measured with setup used, but cannot be excluded a priori. | ||
[[File: | [[File:Picture16.png|550px|center|thumb|Fig. 12: (a) Normalized sheet resistance of 20-Au vs 2-Ti/20-Au samples. The Ti/Au bilayer system has lower sheet resistance than pure Au due to parallel resistors behavior. (b) Normalized sheet resistance of 20-Au vs 2-Cr/20-Au samples. The Cr/Au bilayer system has higher sheet resistance than pure Au due to Cr-Au | ||
alloy formation.]] | alloy formation.]] | ||