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Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions

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[[File:Picture29.png|350px|center|thumb|Fig. 8: STEM-EDX maps of the 2nm Ti/2nm Au sample (a), 2nm Cr/2nm Au sample (b) and 2nm Cr/20nm Au sample (c). The Au L-alpha signal is acquired at 9713 eV, the Ti K-alpha signal at 4510.9 eV and the Cr K-alpha signal at 5414.7 eV.]]
[[File:Picture29.png|350px|center|thumb|Fig. 8: STEM-EDX maps of the 2nm Ti/2nm Au sample (a), 2nm Cr/2nm Au sample (b) and 2nm Cr/20nm Au sample (c). The Au L-alpha signal is acquired at 9713 eV, the Ti K-alpha signal at 4510.9 eV and the Cr K-alpha signal at 5414.7 eV.]]


To verify the chemical composition of the samples, in particular to investigate a possible presence of oxygen in the adhesion layer, STEM-EELS analysis was used. A line scan across the layer interfaces of the 2-Ti/2-Au sample shows the presence of a Ti core loss L3 edge at 460 eV and an L2 edge at 465 eV. A SiO2 O-K edge is visible at 538 eV, while the O-K edge of O bounded to Ti is found at 532 eV (Fig. 5.10a).
To verify the chemical composition of the samples, in particular to investigate a possible presence of oxygen in the adhesion layer, STEM-EELS analysis was used. A line scan across the layer interfaces of the 2nm Ti/2nm Au sample shows the presence of a Ti core loss L3 edge at 460 eV and an L2 edge at 465 eV. A SiO2 O-K edge is visible at 538 eV, while the O-K edge of O bounded to Ti is found at 532 eV (Fig. 9a). The same investigation was performed on the 2nm Cr/2nm Au sample (Fig. 9b). The analysis showed a Cr L3 edge at 585 eV and an L2 edge at 594 eV. The SiO2 O-K edge is visible at 545 eV, while at 540 eV a weak OCr-K edge of O bounded to Cr is visible for a limited thickness below Au. Furthermore, the Cr edge presents a compositional tail along the scan direction, which confirms diffusion into the Au layer. For the length of the tail there is no presence of OCr-K edge, indicating that Cr inside Au is in metallic form. This is in good agreement with the observed diffusion, which involves only metallic Cr.


The same investigation was performed on the 2-Cr/2-Au sample (Fig. 5.10b). The analysis showed a Cr L3 edge at 585 eV and an L2 edge at 594 eV. The SiO2 O-K edge is visible at 545 eV, while at 540 eV a weak OCr-K edge of O bounded to Cr is visible for a limited thickness below Au. Furthermore, the Cr edge presents a compositional tail along the scan
[[File:Picture12.png|350px|center|thumb|Fig. 9: (a) STEM-EELS linear scan of the 2nm Ti/2nm Au sample, showing the presence of oxygen in the Ti layer. (b) STEM-EELS linear scan of the 2nm Cr/2nm Au sample, which shows the presence of oxygen that is bounded to Cr and Cr diffusion into the Au layer.]]
direction, which con�rms di�usion into the Au layer. For the length of the tail there is no presence of OCr-K edge, indicating that Cr inside Au is in metallic form. This is in good agreement with the observed di�usion, which involves only metallic Cr.