Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions
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worse electron scattering centers tahn Au because they have a lower atomic number. | worse electron scattering centers tahn Au because they have a lower atomic number. | ||
[[File:Picture8.png|350px|center|thumb|Fig. | [[File:Picture8.png|350px|center|thumb|Fig. 7: TKD IPFZ maps of the growth direction and grain size distributions of the 2-Ti/20-Au sample (a-b) and of the 2-Cr/20-Au sample (c-d).]] | ||
The smaller grain size is attributed to an enhanced wetting of the deposited Au promoted by the adhesion layer. The enhanced wetting behaviour increases the number of nucleation sites compared to the pure Au film case, where Au is evaporated directly onto the SiO2 surface. This eventually leads to a much denser nucleation of the Au grains, which at the | The smaller grain size is attributed to an enhanced wetting of the deposited Au promoted by the adhesion layer. The enhanced wetting behaviour increases the number of nucleation sites compared to the pure Au film case, where Au is evaporated directly onto the SiO2 surface. This eventually leads to a much denser nucleation of the Au grains, which at the | ||