Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions
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The samples with the adhesion layers and 20 nm Au layer were also analyzed. The addition of the adhesion layer had in both cases a profound impact on grain size and orientation of the Au film, as visible in Fig. 7a and 7c. The image shows small grains mainly oriented in the [111] crystal direction, with an average grain size of 40 nm for Ti (Fig. 7b) and 36 nm for Cr (Fig. 7d). During the collection of the TKD maps, only the Kikuchi patterns produced by the electron scattering from the Au layer were recorded and indexed. Cr and Ti layers did not contribute to the pattern formation due to two main reasons: i) they are too thin to produce enough scattered electrons and ii) they are | The samples with the adhesion layers and 20 nm Au layer were also analyzed. The addition of the adhesion layer had in both cases a profound impact on grain size and orientation of the Au film, as visible in Fig. 7a and 7c. The image shows small grains mainly oriented in the [111] crystal direction, with an average grain size of 40 nm for Ti (Fig. 7b) and 36 nm for Cr (Fig. 7d). During the collection of the TKD maps, only the Kikuchi patterns produced by the electron scattering from the Au layer were recorded and indexed. Cr and Ti layers did not contribute to the pattern formation due to two main reasons: i) they are too thin to produce enough scattered electrons and ii) they are | ||
worse electron scattering centers tahn Au because they have a lower atomic number. | worse electron scattering centers tahn Au because they have a lower atomic number. | ||
[[File:Picture8.png|350px|center|thumb|Fig. 2: TKD IPFZ maps of the growth direction and grain size distributions of the 2-Ti/20-Au sample (a-b) and of the 2-Cr/20-Au sample (c-d).]] | |||
The smaller grain size is attributed to an enhanced wetting of the deposited Au promoted by the adhesion layer. The enhanced wetting behaviour increases the number of nucleation sites compared to the pure Au film case, where Au is evaporated directly onto the SiO2 surface. This eventually leads to a much denser nucleation of the Au grains, which at the | The smaller grain size is attributed to an enhanced wetting of the deposited Au promoted by the adhesion layer. The enhanced wetting behaviour increases the number of nucleation sites compared to the pure Au film case, where Au is evaporated directly onto the SiO2 surface. This eventually leads to a much denser nucleation of the Au grains, which at the | ||