Specific Process Knowledge/Thin film deposition: Difference between revisions
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*Hummer - ''Gold sputtering system'' | *Hummer - ''Gold sputtering system'' | ||
*PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | *PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | ||
*B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid'' | *[[/B2 Furnace LPCVD Nitride|B2 Furnace LPCVD Nitride]] - ''Deposition of silicon nitrid'' | ||
*B3 Furnace LPCVD TEOS - ''Deposition of silicon oxide'' | *[[/B3 Furnace LPCVD TEOS|B3 Furnace LPCVD TEOS]] - ''Deposition of silicon oxide'' | ||
*B4 Furnace LPCVD PolySilicon - ''Deposition of polysilicon'' | *[[/B4 Furnace LPCVD PolySilicon|B4 Furnace LPCVD PolySilicon]] - ''Deposition of polysilicon'' | ||
*MVD - ''Molecular Vapor Deposition'' | *MVD - ''Molecular Vapor Deposition'' | ||