Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions
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Here the characterization work carried out on two main thin-film systems, Cr/Au and Ti/Au stacks, is presented. | Here the characterization work carried out on two main thin-film systems, Cr/Au and Ti/Au stacks, is presented. | ||
[[File:Picture00.png| | [[File:Picture00.png|600px|center|thumb|Fig. 1: Schematic representation of a substrate, adhesion layer and overlayer system. The substrate is either a dielectric or semiconductor material and the over-layer is a metal.]] | ||
= Adhesion layer effect on Au �thin films = | = Adhesion layer effect on Au �thin films = | ||