Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
| Line 64: | Line 64: | ||
|style="background:LightGrey; color:black"|Thickness uniformity | |style="background:LightGrey; color:black"|Thickness uniformity | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*up to 3 % Wafer-in-Wafer variation | *up to 3 % Wafer-in-Wafer variation, Wafer-to-Wafer and Batch-to-Batch variation ** | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Thickness accuracy | |style="background:LightGrey; color:black"|Thickness accuracy | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*May vary by up to about +/- 10 % | *May vary by up to about +/- 10 % | ||
*Less accurate for films below 20 nm | *Less accurate for films below 20 nm | ||
|- | |- | ||