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Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,768 edits
m →Chromium deposition: added live link
Line 41: Line 41:
|0.5Å/s to 10Å/s
|0.5Å/s to 10Å/s
|10Å/s to 15Å/s (e-beam)
|10Å/s to 15Å/s (e-beam)
Sputtering: Depends on process parameters. See process log.
Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log.
|10Å/s
|10Å/s
|Depends on process parameters. See process log.
|Depends on process parameters. See process log.
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