Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

← Older editNewer edit →
VisualWikitext
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,736 edits
→Chromium deposition: updated with Lesker and Temescal
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,736 edits
→Chromium deposition: removed dead link
Line 41: Line 41:
|0.5Å/s to 10Å/s
|0.5Å/s to 10Å/s
|10Å/s to 15Å/s (e-beam)
|10Å/s to 15Å/s (e-beam)
Sputtering: depends on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
Sputtering: Depends on process parameters. See process log.
|10Å/s
|10Å/s
|Depends on process parameters. See process log.
|Depends on process parameters. See process log.
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Chromium"