Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
→Thermal deposition of Silver: added temescal and thermal evaporator, removed alcatel. |
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|-style="background:whitesmoke; color:black" | |-style="background:whitesmoke; color:black" | ||
! Comment | ! Comment | ||
| Pumpdown approx 20 min | | Pumpdown approx 20 min. | ||
| Pumpdown approx 10 min | | Pumpdown approx 10 min. | ||
| Only very thin layers. Pumpdown approx 1 hour. | | Only very thin layers. Pumpdown approx 1 hour. | ||
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| Line 184: | Line 184: | ||
'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | '''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | ||
'''**''' ''Please ask responsible staff for 8" wafer holder'' | '''***''' ''Please ask responsible staff for 8" wafer holder'' | ||