Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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= | ==The Temescal Acceptance test== | ||
Topics: | |||
*Vacuum performance | |||
*Ion beam etching of SiO2 | |||
*E-beam testing: Ti/Au and Ti/Ni deposition | |||
The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness. | |||
For metal films, the thickness and for Ti/Ni the sheet resistance uniformity were measured. Furthermore the side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | |||
Full acceptance test report here: [[:File:Temescal Acceptance Test Results Mar-April-May 2018.pdf]] | |||
Revision as of 13:54, 12 September 2018
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The Temescal Acceptance test
Topics:
- Vacuum performance
- Ion beam etching of SiO2
- E-beam testing: Ti/Au and Ti/Ni deposition
The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness.
For metal films, the thickness and for Ti/Ni the sheet resistance uniformity were measured. Furthermore the side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt.
Full acceptance test report here: File:Temescal Acceptance Test Results Mar-April-May 2018.pdf