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Specific Process Knowledge/Thin film deposition: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
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*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool''
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool''
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*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
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*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool''
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See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
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