Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 09:56, 6 July 2018

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO₂, Titanium Oxide) Alumina (Al₂O₃, Aluminium Oxide) Aluminum Nitride (Al_xN_y) Tantalum (Ta₂O₅, Tantalum pentoxide) Cromia (Cr₂O₃, Chromium Oxide) Hafnium Oxide Titanium Nitride - cheramic	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Chromium Cobalt Copper Gold Iron Magnesium Molybdenum Nickel Niobium Palladium Platinum Ruthenium Silver Tantalum Tin Titanium Tungsten	TiW alloy (10%/90% by weight) NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	ALD	Coaters	Others
Lesker - Sputter tool Wordentec - E-beam evaporator, sputter and thermal evaporator Thermal evaporator - Thermal evaporator E Beam Evaporator (Temescal) Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater 03 - Gold sputtering system Sputter coater 04 - Gold sputtering system III-V Dielectric evaporator - E-beam evaporation tool Alcatel - (Will be decommissioned) E-beam evaporator and sputter tool PVD co-sputter/evaporation - (Decommissioned) E-beam evaporator and multiple wafer tool	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD1 - Atomic Layer Deposition (thermal) ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel Electroplating-Cu - Electrochemical deposition of copper MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 94: / Line 94: @@
 *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
 *[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool''
+*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool''
+*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool''
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 *[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
@@ Line 104: / Line 106: @@
 *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
 *[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
-*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool''
-*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool''
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 See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers