Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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== Process information == | == Process information == | ||
====Materials for e-beam evaporation==== | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]] | |||
*[[Specific Process Knowledge/ | *[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium|Chromium (Cr)]] | ||
*[[Specific Process Knowledge/ | *[[Specific Process Knowledge/Thin film deposition/Deposition of Copper|Copper (Cu)]] | ||
*[[Specific Process Knowledge/ | *[[Specific Process Knowledge/Thin film deposition/Deposition of Gold|Gold (Au)]] | ||
*[[Specific Process Knowledge/ | *[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum|Molybdenum (Mo)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel|Nickel (Ni)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Palladium|Palladium (Pd)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Platinum|Platinum (Pt)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tantalum|Tantalum (Ta)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tin|Tin (Sn)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]] | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]] - thinner layers | |||
Note that to date (July 2018) we have processes available for deposition of Al, Cr, Au, Ni, Pd, Ag, Ti, and W as well as Ru. More will be available as they are requested, e.g., Nb is expected in the early fall of 2018. | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||