Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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			'''Deposited rates'''

	This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec\|here]]) and may change with these settings.		This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec\|here]]) and may change with these settings.