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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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== General Pegasus information ==
== General Pegasus information ==


'''Wafer bonding'''
===Wafer bonding===


To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| '''HERE''']].




'''Characterisation of etched trenches'''
===Characterisation of etched trenches===


Comparing differences in etched trenches requires a set of common parameters for each trench. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|here]] to find more information about the parameters used on the DRIE-Pegasus process development.
Comparing differences in etched trenches requires a set of common parameters for each trench. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|'''HERE''']] to find more information about the parameters used on the DRIE-Pegasus process development.


'''Material from SPTS'''
===Material from SPTS===


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs|Hardware and process applications]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs|Hardware and process applications]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]]
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