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Specific Process Knowledge/Etch/III-V ICP/InP-InGaAsP-InGaAs: Difference between revisions

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===Changing the Cl2/N2 ratio===
===Changing the Cl2/N2 ratio===


<gallery caption="Result of InP etching."  widths="500px" heights="400px" perrow="3">
<gallery caption="Result of changing the Cl2/N2 ratio."  widths="500px" heights="400px" perrow="3">


Image:S0_oxide_05.jpg|Top view of the oxide mask before etching. It is the TRAVKA50 mask, but it is clear that the CD reduction is about the 1-1.5 µm of the lines.
Image:S0_oxide_05.jpg|Top view of the oxide mask before etching. It is the TRAVKA50 mask, but it is clear that the CD reduction is about the 1-1.5 µm of the lines.