Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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 |style="background:whitesmoke; color:black"|Sizes
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>#</nowiki> small samples on carriers
+* Smaller than 100mm: Bonded to carriers
-*<nowiki>#</nowiki> 50 mm wafers: Bonded to carriers
+* 100 mm wafers: Up to 25 wafers in a batch process
-*<nowiki>#</nowiki> 100 mm wafers: Up to 18 wafers in a batch process
+|style="background:WhiteSmoke; color:black"|
-*<nowiki>#</nowiki> 150 mm wafers: 1 wafer
+* Smaller than 150mm: Bonded to carriers
+* 150 mm wafers
+|style="background:WhiteSmoke; color:black"|
+* Smaller than 150mm: Bonded to carriers
+* 150 mm wafers
+|style="background:WhiteSmoke; color:black"|
+* Smaller than 150mm: Bonded to carriers
+* 150 mm wafers
 |-
 | style="background:Lightgrey; color:black"|Loading