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Specific Process Knowledge/Etch: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
Line 62: Line 62:
*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]]
*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]]
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]]
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]]
*[[/DRIE-Pegasus|DRIE-Pegasus tools (Silicon Etch), currently we have two, but two more will follow]]
*[[/DRIE-Pegasus|DRIE-Pegasus 1 and 2 (Silicon Etch)]
*[[/ICP Metal Etcher|ICP Metal Etch]]
*[[/ICP Metal Etcher|ICP Metal Etch]]
*[[/III-V ICP|III-V ICP]]
*[[/III-V ICP|III-V ICP]]
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