Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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[[File:RF matching 2.jpg|600px|thumb]] | [[File:RF matching 2.jpg|600px|thumb]] | ||
* In the left side of the image before it says 5 mTorr, the capacitors are at the setpoint values and there is no adjustment. Once the plasma ignites (when the pressure setting changes to 5 mTorr), the capacitors respond in a typical fashion to find a minimum of reflected power. Once this is done (usually in a matter of a few seconds), they change only little. | * In the left side of the image before it says 5 mTorr, the capacitors are at the setpoint values and there is no adjustment. Once the plasma ignites (when the pressure setting changes to 5 mTorr), the capacitors respond in a typical fashion to find a minimum of reflected power. Once this is done (usually in a matter of a few seconds), they change only little. | ||
* When the pressure changes (the point on the X axis where the 10 mTorr regime starts), the matching network responds and settles | * When the pressure changes (the point on the X axis where the 10 mTorr regime starts), the matching network responds and settles into new positions with a minimum power. SPTS labels this a 'sweet spot'. | ||
* The positions of Load and Tune change as the pressure is gradually increased to 90 mTorr. The change is, in fact, very significant compared to when changes in other process parameters (such as power, gas flow or temperature) are varied during processing in a similar experiment. | |||