Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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[[File:RF matching 2.jpg|600px|thumb]] | [[File:RF matching 2.jpg|600px|thumb]] | ||
In the left side of the image before it says 5 mTorr, the capacitors are at the setpoint values and there is no adjustment. Once the plasma ignites (when the pressure setting changes to 5 mTorr), the capacitors respond in a typical fashion | * In the left side of the image before it says 5 mTorr, the capacitors are at the setpoint values and there is no adjustment. Once the plasma ignites (when the pressure setting changes to 5 mTorr), the capacitors respond in a typical fashion to find a minimum of reflected power. Once this is done (usually in a matter of a few seconds), they change only little. | ||
* When the pressure changes (the point on the X axis where the 10 mTorr regime starts), the matching network responds and settles in new positions. | |||