Specific Process Knowledge/Characterization/XPS/XPS Depth profiling: Difference between revisions
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* Nitrogen, also fully oxidized (oxidation state IV) | * Nitrogen, also fully oxidized (oxidation state IV) | ||
and plot their atomic percentages along with the percentages of oxygen and nitrogen. | and plot their atomic percentages along with the percentages of oxygen and nitrogen. | ||
== asdf == | |||
{| {{table } } | |||
| width="50" align="center" style="background:#f0f0f0;"| | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_.28Sensofar.29|Optical profiler]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XPS#XPS-ThermoScientific|XPS]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XRD|XRD]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/DSC_Perkin_Elmer|Differential Scanning Calorimeter DSC]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/KLA-Tencor_Surfscan_6420|Surfscan]]''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''IR-camera''' | |||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]''' | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Breakdown voltage | |||
|||||||||||||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Carrier density/doping profile | |||
||||||||||||||||||||||||||||||||||||||||x | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Charge carrier life time||||||||||||||||||||||||||||x|||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x|||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Crystallinity||||||||||||||||||||||||||x||||||||x|||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Deposition uniformity||||||||||x||x||x|||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Dimensions(in plane)||x||x||(x)||(x)||x|||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)]]||(x)||(x)||x||x||x|||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Electrical conductivity||||||||||||||||||||||||x|||||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x 4)||||||x 4)|||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x|||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x|||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x|||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Band gap||||||||||||||x||||||x|||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Particles||x||x||x||||||||||||||||||||||||||||||x|||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Phase changes||||||||||||||||||||||||||||||||||x|||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Reflectivity||||||||||||x||x||||||x 6)|||||||||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x|||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Resistivity||||||||||||||||||||||x|||||||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Step coverage||x 1)||x 1)|||||||||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| Surface roughness||||||x||x||x|||||||||||||||||||||||||||||| | |||
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|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Thermal conductivity|||||||||||||||||||||||||||||||||||||||| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x 1)||x 1)||x 2)||x 2)||x ||x||x||||||x 5)||x 3)||||x|||||||||||||| | |||
|- | |||
|-style="background:#C0C0C0;" align="center" | |||
|align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||||x|| | |||
|- | |||
|-style="background:#DCDCDC;" align="center" | |||
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x 1)||x 1)||||||||||||x|||||||||||||||||||||||| | |||
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