Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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== Studies of Cr deposition processes == | == Studies of Cr deposition processes == | ||
[[/Deposition of Chromium|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different settings'' | [[/Deposition of Chromium|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different methods and settings'' | ||
[[Sputtering of Cr in Wordentec]] - ''Settings and deposition rates'' | [[Sputtering of Cr in Wordentec]] - ''Settings and deposition rates'' | ||
Revision as of 10:07, 11 August 2008
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 1µm | . |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s | . |
Studies of Cr deposition processes
Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings
Sputtering of Cr in Wordentec - Settings and deposition rates