Specific Process Knowledge/Lithography/Coaters: Difference between revisions

@@ Line 676: / Line 676: @@
 {| border="2" cellspacing="0" cellpadding="2"
-!style="background:silver; color:black;" align="center" width="60"|Purpose
+|-
-|style="background:LightGrey; color:black"|
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
-|style="background:WhiteSmoke; color:black"|
+|style="background:LightGrey; color:black"|Labspin
-*Spin coating of resist ONLY in dedicated bowlsets for '''Labspins'''
+|style="background:WhiteSmoke; color:black" align="center"|
-*Please do NOT use substances which is not for the dedicated bowlsets
+Spin coating of resist ONLY in dedicated bowlsets
-*Spin coating of dirty substances in '''All purpose'''
+Please do NOT use substances which is not for the dedicated bowlsets
+|-
+|style="background:LightGrey; color:black"|All purpose
+|style="background:WhiteSmoke; color:black" align="center"|
+Spin coating of dirty substances in '''All purpose'''
+<br>
 |-
@@ Line 698: / Line 703: @@
 |style="background:LightGrey; color:black"|Substrate size
 |style="background:WhiteSmoke; color:black"|
-*Chips5x5 mm and up
+*Chips 5x5 mm and up
 *50 mm wafers
 *100 mm wafers
@@ Line 707: / Line 712: @@
 |style="background:WhiteSmoke; color:black" align="center"|
 All cleanroom materials
-'''Please ONLY use substances which is for the dedicated bowlsets in labspins'''
+|'''Please ONLY use substances which is for the dedicated bowlsets in labspins'''
 |-