Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Silicon/Si_etch_using_ASE click here]''' | ||
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*[http://labmanager | *[http://labmanager.dtu.dk/d4Show.php?id=1607&mach=105 The QC procedure for ASE] | ||
*[http://labmanager | *[http://labmanager.dtu.dk/view_binary.php?fileId=1751 The newest QC data for ASE] | ||
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The recipe Iso is the same recipe as Deepetch but without the passivation steps. <br> | The recipe Iso is the same recipe as Deepetch but without the passivation steps. <br> | ||
It has been tested once by Filip Sandborg-Olsen @nanotech. <br> | It has been tested once by Filip Sandborg-Olsen @nanotech. <br> | ||
He etched with 100% load for | He etched with 100% load for 10 min. He got an etch rate of 5.51µm/min | ||
== Process development == | == Process development == | ||
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Older work: | Older work: | ||
Three different examples of etch are shown here. The masking material was zep520A (80 nm). By BGHE@ | Three different examples of etch are shown here. The masking material was zep520A (80 nm). By BGHE@dtu.dk | ||
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