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Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions

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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,301 edits
Line 328: Line 328:
|<!--'''Selectivity (resist:Si)'''-->
|<!--'''Selectivity (resist:Si)'''-->
1:4.8
1:4.8
|<!--'''Etch rate in Si'''-->  
|<!--'''Etch rate in SiO2'''-->
SRN:1 nm/s
32 nm/min
SRN:60 nm/min




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