Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment.
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.





Revision as of 07:24, 11 August 2008

Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Leybold) E-beam evaporation (Wordentec) Sputter deposition (Wordentec)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 8x4" wafers or
  • 5x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean Ar ion bombartment RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm 10Å to 0.5µm 10Å to 1µm .
Deposition rate 2Å/s to 15Å/s 1Å/s to 5Å/s 10Å/s to 15Å/s .


Studies of Cr deposition processes

Uniformity of Cr layers - Uniformity of Cr layers deposited with different settings

Sputtering of Cr in Wordentec - Sputtering of Cr in Wordentec (settings and rates)