Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

From LabAdviser
Kn (talk | contribs)
No edit summary
Kn (talk | contribs)
Undo revision 2807 by Kn (Talk)
Line 48: Line 48:
== Studies of Cr deposition processes ==
== Studies of Cr deposition processes ==


[[Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different settings''
[[/Deposition of Chromium|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different settings''


[[/Deposition of Chromium|Sputtering of Cr in Wordentec]] - ''Sputtering of Cr in Wordentec (settings and rates)''
[[/Deposition of Chromium|Sputtering of Cr in Wordentec]] - ''Sputtering of Cr in Wordentec (settings and rates)''

Revision as of 14:06, 8 August 2008

Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Leybold) E-beam evaporation (Wordentec) Sputter deposition (Wordentec)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 8x4" wafers or
  • 5x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean Ar ion bombartment RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm 10Å to 0.5µm 10Å to 1µm .
Deposition rate 2Å/s to 15Å/s 1Å/s to 5Å/s 10Å/s to 15Å/s .


Studies of Cr deposition processes

Uniformity of Cr layers - Uniformity of Cr layers deposited with different settings

Sputtering of Cr in Wordentec - Sputtering of Cr in Wordentec (settings and rates)