Specific Process Knowledge/Characterization/Hardness measurement: Difference between revisions

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==Hardness measurer==
==Hardness measurer==
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]]
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Hardness Measurer. Positioned in cleanroom F-2]]


The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
The purpose is to measure hardness of samples or films.  
 
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.  




'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=xxx Hardness measurer]'''


==Quality Control - Recipe Parameters and Limits==
==Quality Control - Recipe Parameters and Limits==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|bgcolor="#98FB98" |'''Quality Control (QC) for the hardness measurer'''
|-
|-
|  
|  
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
The measured standard hardnesses are 2xx HV, 4xx HV and 6xx HV. The QC is performed x times a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=xxx The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
 
|}
|}


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Hardness measurer
Hardness measurer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Wafer thickness
*Sample thickness
*Depths of larger grooves
*Film thickness
*Heigth of larger mesas
|-
|-
!style="background:silver; color:black" align="center"|
!style="background:silver; color:black" align="center"|
Performance
Performance
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Thickness resolution
Indent force
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*< 5 µm
*0,05N
*0,15N
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
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| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*No restrictions  
*No restrictions (besides sample must be dry and free from chemical residues)
|-  
|-  
|}
|}

Revision as of 13:48, 19 January 2018

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Hardness measurer

Hardness Measurer. Positioned in cleanroom F-2

The purpose is to measure hardness of samples or films.


The user manual, technical information and contact information can be found in LabManager:

Hardness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the hardness measurer

The measured standard hardnesses are 2xx HV, 4xx HV and 6xx HV. The QC is performed x times a year.


Equipment performance and process related parameters

Purpose

Hardness measurer

  • Sample thickness
  • Film thickness

Performance

Indent force

  • 0,05N
  • 0,15N

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions (besides sample must be dry and free from chemical residues)