Specific Process Knowledge/Characterization/Hardness measurement: Difference between revisions
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== | ==Hardness measurer== | ||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | ||
Revision as of 13:39, 19 January 2018
Feedback to this page: click here
Hardness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
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Purpose |
Hardness measurer |
|
|---|---|---|
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Performance |
Thickness resolution |
|
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Substrates |
Batch size |
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| Substrate materials allowed |
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