Specific Process Knowledge/Back-end processing: Difference between revisions
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**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
*Wafer dicing/machining | *Wafer dicing/machining | ||
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | |||
**[[/Polishing machine|Polisher/Lapper machine]] | **[[/Polishing machine|Polisher/Lapper machine]] | ||
**[[/Wafer Scriber|Wafer Scriber]] | **[[/Wafer Scriber|Wafer Scriber]] | ||