Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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'''Feedback to this page''': '''[mailto: | '''Feedback to this page''': '''[mailto:fabricationsupport@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]''' | ||
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[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]] | [[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]] | ||
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[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager] | ||
== Process information == | == Process information == | ||
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== Flip-chip bonder (glue attachment) == | == Flip-chip bonder (glue attachment) == | ||
[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in | [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in the Packlab in building 347, 1. floor.]] | ||
The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate. | The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate. | ||
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With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate. | With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate. | ||
The Flip Chip Bonder is placed in | The Flip Chip Bonder is placed in Nanolab Packlab building 347, 1. floor. | ||
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:''' | '''The user manuals, user APVs, technical information and contact information can be found in LabManager:''' | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager] | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||