Specific Process Knowledge/Back-end processing/Die Bonder

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The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.

Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information

• Au-Sn eutectic die bonding

Flip-chip bonder (glue attachment)

The Flip chip bonder is placed in Danchip's Packlab building 347, 1. floor.

The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.

With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.

The Flip Chip Bonder is placed in Danchip's Packlab building 347, 1. floor.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Flip-chip Bonder in LabManager

Equipment performance and process related parameters

Equipment		Die bonder	Flip-chip bonder
Purpose		Fine placement of dies Eutectic metal soldering	Fine placement of dies Glue attachment
Performance		Low thermal resistance Always conducting	Medium or High thermal resistance Possibility of both conducting and isolating adhesives If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates	Allowed materials	Should be able to withstand the soldering temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)	Any that is compatible with the glue and temperature used