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Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions

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*Thermal evaporation
*Thermal evaporation
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!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Film thickness|
|style="background:LightGrey; color:black"|Film thickness
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|style="background:WhiteSmoke; color:black"|
*~10Å - 1µm
*~10Å - 1µm
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|style="background:LightGrey; color:black"|Deposition rate
|style="background:LightGrey; color:black"|Deposition rate
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|style="background:WhiteSmoke; color:black"|
*~2.5Å/s - 15Å/s
*~2.5Å/s - 15Å/s
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!style="background:silver; color:black" align="left"|Process parameter range
!style="background:silver; color:black" align="left" rowspan= "2"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
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*Less than 80 <sup>o</sup>C
*Less than 80 <sup>o</sup>C
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|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
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*~3x10<sup>-7</sup> - 4x10<sup>-6</sup> mbar
*~3x10<sup>-7</sup> - 4x10<sup>-6</sup> mbar
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!style="background:silver; color:black" align="left"|Substrates
!style="background:silver; color:black" align="left" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
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*Deposition on one side of the substrate
*Deposition on one side of the substrate
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| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
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|style="background:WhiteSmoke; color:black"|
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*Pyrex wafers
*Pyrex wafers
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| style="background:LightGrey; color:black"|Material allowed on the substrate
| style="background:LightGrey; color:black"|Material allowed on the substrate
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