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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride: Difference between revisions

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It is also possible to deposit silicon nitride using the Lesker sputter system. However, the process hasnot been tested yet, but the required sputter targets for nitride deposition are avaliable.  
It is also possible to deposit silicon nitride using the Lesker sputter system. However, the process hasnot been tested yet, but the required sputter targets for nitride deposition are avaliable.  


*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 4" LPCVD nitride furnace|Deposition of low stress nitride using the 4" LPCVD nitride furnace]]
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of stoichiometric nitride using the 4" LPCVD nitride furnace|Deposition of stoichimetric nitride using the 4" LPCVD nitride furnace]]
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace]]
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 6" LPCVD nitride furnace|Deposition of low stress (silicon rich) nitride using the 6" LPCVD nitride furnace]]


*[[/Deposition of Silicon Nitride using PECVD|Nitride deposition using PECVD]] (''or oxynitride'')
*[[/Deposition of Silicon Nitride using PECVD|Nitride deposition using PECVD]] (''or oxynitride'')
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