Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]''' | ||
==Thickness measurer== | |||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | |||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | |||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | |||
'''The user manual, technical information and contact information can be found in LabManager:''' | |||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | |||
==Quality Control - Recipe Parameters and Limits== | |||
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|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer''' | |||
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | |||
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | |||
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br> | |||
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==Equipment performance and process related parameters== | |||
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Purpose | |||
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Thickness measurer | |||
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*Wafer thickness | |||
*Depths of larger grooves | |||
*Heigth of larger mesas | |||
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Performance | |||
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Thickness resolution | |||
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*< 5 µm | |||
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Substrates | |||
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Batch size | |||
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*One sample | |||
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| style="background:LightGrey; color:black"|Substrate materials allowed | |||
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*No restrictions | |||
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