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<center><span style="background:#87CEEB">4th Level - Comparison</span></center>
<center><span style="background:#87CEEB">4th Level - Comparison</span></center>
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
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