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Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231, fotonik
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Rmal (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231, fotonik
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Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% H<sub>2</sub>O, 2.5% APTMS.
Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% H<sub>2</sub>O, 2.5% APTMS.


''NOTE: the APTMS is time sensitive, so deposit it as close to the Au deposition as possible.''
''NOTE: the APTMS layer is degrading quickly in atmosphere, so deposit it as close to the Au deposition as possible.''


Lesker deposition parameters:
Lesker deposition parameters:
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''NOTE: As a general rule, the lower the pressure and higher the power, the better.''  
''NOTE: As a general rule, the lower the pressure and higher the power (i.e. higher the deposition rate), the better.''  


Film characteristics:
Film characteristics:
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