Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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== Thin Au layer deposition == | == Thin Au layer deposition using Lesker== | ||
For depositing very thin, down to 6nm continuous Au layers on Si/ | For depositing very thin, down to 6nm continuous Au layers on Si/SiO<sub>2</sub> substrates. Works also with ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> as substrate. | ||
Adhesion promoter: aminopropyltrimethoxysilane (APTMS) | Adhesion promoter: aminopropyltrimethoxysilane (APTMS). | ||
Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% | Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% H<sub>2</sub>O, 2.5% APTMS. | ||
''NOTE: the APTMS is time sensitive, so deposit it as close to the Au deposition as possible.'' | |||
Lesker deposition parameters: | |||
{| border="1" cellspacing="0" cellpadding="2" | |||
! Gun # | |||
! Power [W] | |||
! Ramp rate [W/s] | |||
! Pressure [mtorr] | |||
! Atmosphere | |||
! Deposition rate [nm/s] | |||
|- | |||
|2 | |||
|300 | |||
|5 | |||
|3 | |||
|Ar | |||
|1 | |||
|} | |||
''NOTE: As a general rule, the lower the pressure and higher the power, the better.'' | |||
Film characteristics: | |||
{| border="1" cellspacing="0" cellpadding="2" | |||
! Thickness [nm] | |||
! Roughness min [nm] | |||
! Roughness max [nm] | |||
|- | |||
|6 | |||
|0.25 | |||
|0.4 | |||
|- | |||
|10 | |||
|0.3 | |||
|0.5 | |||
|- | |||
|24 | |||
|0.3 | |||
|0.5 | |||
|} | |||
''NOTE: After depositing 10layers of 10nm each, the roughness increased to 0.8nm RMS'' | |||
Work done by Johneph Sukham ([mailto:johsu@fotonik.dtu.dk?Subject=Thin Au deposition using Lesker click to email]) and Radu Malureanu ([mailto:rmal@dtu.dk?Subject=Thin Au deposition using Lesker click to email]) | |||