Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions
No edit summary |
|||
| Line 66: | Line 66: | ||
*Silicon (oxy)nitride | *Silicon (oxy)nitride | ||
*Poly Silicon | *Poly Silicon | ||
*Metals: Au, Sn, Ag, Al, Ti | *Metals: Au, Sn, Ag, Al, Ti | ||
|- | |- | ||
|} | |} | ||