Specific Process Knowledge/Lithography/NanoImprintLithography

Imprinter 01

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Wet Poly Etch: Positioned in cleanroom D-3 to the left in the bench

The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

The user manual, user APV, and contact information can be found in LabManager

Imprint information

• Imprinting

Overview of the performance of the Imprinter 01 and some process related parameters

Purpose		Imprinting
Performance	Alignment accuracy	Only by eye
Process parameter range	Process Temperature	Room temperature to 200°C
	Process pressure	~5$\cdot$1mbar - atm
	Imprint Pressure	0-6 bar
Substrates	Batch size	Pieces to 4" wafers
	Substrate material allowed	Silicon Quartz Pyrex
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Poly Silicon Photoresist PMMA TOPAS SU-8 Metals: Au, Sn, Ag, Al, Ti.