Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions

From LabAdviser
Rkch (talk | contribs)
Rkch (talk | contribs)
Line 5: Line 5:
'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''
'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''


[[Image:polyetch1.jpg|300x300px|thumb|Wet Poly Etch: Positioned in cleanroom D-3 to the left in the bench]]
 


The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).  
The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).  

Revision as of 10:25, 19 May 2017

Imprinter 01

Feedback to this section: Imprinter 01 click here


The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

The user manual, user APV, and contact information can be found in LabManager



Imprint information


Overview of the performance of the Imprinter 01 and some process related parameters

Purpose
  • Imprinting
Performance Alignment accuracy
  • Only by eye
Process parameter range Process Temperature
  • Room temperature to 200°C
Process pressure
  • ~51mbar - atm
Imprint Pressure
  • 0-6 bar
Substrates Batch size
  • Pieces to 4" wafers
Substrate material allowed
  • Silicon
  • Quartz
  • Pyrex
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Poly Silicon
  • Photoresist
  • PMMA
  • TOPAS
  • SU-8
  • Metals: Au, Sn, Ag, Al, Ti.