Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
/* Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an 'RCA clean' prior to bonding (and doing the cleaning as well as the bonding very early in the morning with very few people in the cle... |
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==Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an '[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and doing | ==Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an '[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and doing cleaning and bonding very early in the morning with few people and thus lower particle level) gives the best results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Danchip to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use.== | ||
===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ||