Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
| Line 3: | Line 3: | ||
<br \> | <br \> | ||
===The IMEC process | ==Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an '[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and doing the cleaning as well as the bonding very early in the morning with very few people in the cleanroom and thus fewer particls) gives good results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Danchip to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use.== | ||
===The IMEC process: Cleaning of wafers prior to fusion bonding=== | |||
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' Has been slightly modified by Karen Birkelund. | The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' Has been slightly modified by Karen Birkelund. | ||