Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions

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'''The user manual, user APV and contact information can be found in LabManager:'''
'''Information about the equipment used in this procedure cand be found in LabManager:'''<br>
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=66 Buffered HF-Wetting agent/IMEC info page in LabManager]
Info page for '[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=383 Wafer Cleaning]'




Revision as of 08:25, 19 May 2017

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The IMEC process is used for cleaning of wafers prior to fusion bonding

The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995. Has been slightly modified by Karen Birkelund.


Information about the equipment used in this procedure cand be found in LabManager:
Info page for 'Wafer Cleaning'



Step Process Details Comments Comments
1 Pre-bond cleaning of Si wafers prior to fusion bonding. .
  • Takes approximately 1,5 hours
  • Orient flat to minimize handling
  • Preferably do the cleaning just before bonding to maintain cleanliness!
 Get CLEAN box for wafers!!!
2 Piranha Mixture: H2SO4:H2O2 (4:1)

Temp: 80oC Time: 5 min (a yellow and a black spot)

You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!. Alternatively use a very clean glass beaker. The recommended procedure is:
  • Pour H2SO4 into bath/beaker
  • Place wafers in clean carrier (USE this in steps 2-7)
  • Add H2O2 to the beaker that already contains H2SO4
  • Wait 30 sec to ensure mixing of chemicals, then dip wafers.
 Maybe clean the tank the day before!
3 Rinse 2 min. rinse Rinse you wafers with DI-water. Put into dedicated wet box for IMEC
4 IMEC Mixture: DI water:5% HF:Isopropanol (100:10:1)

Temp: 25 oC Time: 100 sec (two black spots)

Make an appointment some days in advance with a Danchip employee to help you with this step!
  • Clean tank (Cleanroom D-3, the 'Optional Bath' inside Wet Bench 05: Al etch)
  • Mix your IMEC solution in dedicated bottle (IMEC) inside a fume hood
  • Ask a Danchip employee to help you filling the solution into the 'Optional Bath' tank!

.

5 Rinse 2 min. rinse Put into dedicated wet box for IMEC .
6 Piranha Not nitride wafers!

Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min

Re-use previous piranha

Makes wafers hydrophilic

.
7 Rinse & spin dry 5 min rinse . .
8 Put wafers in new clean carrier box . . .
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