Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions
| Line 10: | Line 10: | ||
==Process information== | ==Process information== | ||
[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]] | |||
====Types of Bonding==== | ====Types of Bonding==== | ||
*[[Specific Process Knowledge/Bonding/Eutectic bonding|Eutectic bonding]] | *[[Specific Process Knowledge/Bonding/Eutectic bonding|Eutectic bonding]] | ||
*[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]] | *[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]] | ||
*[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]] | *[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]] | ||
==Overview of the performance of the Wafer Bonder 02 and some process related parameters== | ==Overview of the performance of the Wafer Bonder 02 and some process related parameters== | ||