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Specific Process Knowledge/Bonding: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
284 edits
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*[[/Anodic bonding|Anodic bonding]]
*[[/Anodic bonding|Anodic bonding]]


== Comparing the three bonding methods in the EVG NIL (EVG NIL has been <span style ="color: red"> Decommissioned </span>) ==
== Comparing the three bonding methods in the wafer bonder 2 ==


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Substrate size
!Substrate size
|Up to 6" (aligning only possible for 4" and 6")
|Up to 6"
|Up to 6" (aligning only possible for 4" and 6")
|Up to 6"
|Up to 6" (aligning only possible for 4" and 6") 
|Up to 6"  
|-
|-


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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!IR alignment
!Backside alignment
|Double side polished wafers.
|Double side polished wafers.
|Double side polished wafers.
|Double side polished wafers.
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