Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
| Line 29: | Line 29: | ||
*Takes approximately 1,5 hours | *Takes approximately 1,5 hours | ||
*Orient flat to minimize handling | *Orient flat to minimize handling | ||
* | *Preferably do the cleaning just before bonding to maintain cleanliness! | ||
|Get CLEAN box for wafers!!! | |Get CLEAN box for wafers!!! | ||
|- | |- | ||
| Line 38: | Line 38: | ||
Time: 5 min | Time: 5 min | ||
(a yellow and a black spot) | (a yellow and a black spot) | ||
|You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). <b>However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!</b>. Alternatively use a very clean glass beaker. | |You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). <b>However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!</b>. Alternatively use a very clean glass beaker. The recommended procedure is: | ||
Pour | *Pour H<sub>2</sub>SO<sub>4</sub> into bath/beaker | ||
*Place wafers in clean carrier (USE this in steps 2-7) | |||
*Add H<sub>2</sub>O<sub>2</sub> to the beaker that already contains H<sub>2</sub>SO<sub>4</sub> | |||
*Wait 30 sec to ensure mixing of chemicals, then dip wafers. | |||
|Maybe clean the tank the day before! | |Maybe clean the tank the day before! | ||
|- | |- | ||
| Line 45: | Line 48: | ||
|Rinse | |Rinse | ||
|2 min. rinse | |2 min. rinse | ||
|. | |Rinse you wafers with DI-water. | ||
|Put into dedicated wet box for IMEC | |Put into dedicated wet box for IMEC | ||
|- | |- | ||
|4 | |4 | ||
|IMEC | |IMEC | ||
|DI water:5% HF: | |Mixture: DI water:5% HF:Isopropanol (100:10:1) | ||
Temp: 25 <sup>o</sup>C | Temp: 25 <sup>o</sup>C | ||
Time: 100 sec | Time: 100 sec | ||
(two black spots) | (two black spots) | ||
|Clean tank ( | |<b>Make an appointment some days in advance with a Danchip employee to help you with this step!</b> | ||
*Clean tank (Cleanroom D-3, the 'Optional Bath' inside Wet Bench 05: Al etch) | |||
*Mix your IMEC solution in dedicated bottle (IMEC) inside a fume hood | |||
*Ask a Danchip employee to help you filling the solution into the 'Optional Bath' tank! | |||
| | | | ||
. | . | ||
Revision as of 08:20, 19 May 2017
Feedback to this page: click here
The IMEC process is used for cleaning of wafers prior to fusion bonding
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995. Has been slightly modified by Karen Birkelund.
The user manual, user APV and contact information can be found in LabManager: Buffered HF-Wetting agent/IMEC info page in LabManager
| Step | Process | Details | Comments | Comments |
|---|---|---|---|---|
| 1 | Pre-bond cleaning of Si wafers prior to fusion bonding. | . |
|
Get CLEAN box for wafers!!! |
| 2 | Piranha | Mixture: H2SO4:H2O2 (4:1)
Temp: 80oC Time: 5 min (a yellow and a black spot) |
You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!. Alternatively use a very clean glass beaker. The recommended procedure is:
|
Maybe clean the tank the day before! |
| 3 | Rinse | 2 min. rinse | Rinse you wafers with DI-water. | Put into dedicated wet box for IMEC |
| 4 | IMEC | Mixture: DI water:5% HF:Isopropanol (100:10:1)
Temp: 25 oC Time: 100 sec (two black spots) |
Make an appointment some days in advance with a Danchip employee to help you with this step!
|
. |
| 5 | Rinse | 2 min. rinse | Put into dedicated wet box for IMEC | . |
| 6 | Piranha | Not nitride wafers!
Mixture: H2SO4:H2O2 (4:1) Temp: 80 oC Time: 20 min |
Re-use previous piranha
Makes wafers hydrophilic |
. |
| 7 | Rinse & spin dry | 5 min rinse | . | . |
| 8 | Put wafers in new clean carrier box | . | . | . |